Our double and multilayer facility was established in 2002, since then there had been enormous upgrades and expansions to meet market demands. The total monthly capacity is 72,000m². To meet the technological and ecological demands of today's industries, we offer a wide range of product that will fulfill those needs

Below are some highlights of our advanced processes:

● 5 Fully automatic plating lines

● Horizontal spray solder mask system

● Wet & Dry film

● Fully automatic ENIG line

● Leadfree Hot air solder levelling

● OSP coating with optional chemical withstanding 3 times solder reflow

● Ionic cleaning

● CNC V-cut

● CNC drilling

● CNC routing

● Outline punching